These are exciting times in the world of LED: Both established and emerging technologies are enabling the development of new and exciting products – sharper, more efficient, and simply better. At this year’s ISE, Chip on Board (COB) made a big impression at the LANG booth and clearly positioned itself as a forward-looking technology for the near future.

But while COB – and rightly so – is the current talk of the industry, with products like LEDgend and the ENKI rental solution showcasing its benefits in practice, another fine-pitch technology is quietly securing its own place in the LED landscape.

MIP, short for Micro LED in Package, combines the benefits of ultra-fine pixel pitches with tried-and-tested manufacturing processes. But how exactly are such LED products made? What are the advantages? And what defines MIP as a technology?

How does MIP work?

In MIP technology, tiny Micro LED chips are embedded into standardized packages. These packages can then be mounted onto circuit boards – much like in the SMD process. Because of the miniaturized chips, MIP enables extremely small pixel pitches, well below one millimeter.

One of MIP’s major strengths lies in its modular design: a single package type can be used for various pixel pitches, which not only simplifies planning but also reduces production costs.

This modularity pays off particularly well in mass production: the packages can be processed using existing SMD production lines – with no need for costly new investments or extensive restructuring. At the same time, manufacturers benefit from a high yield rate, since individual LED packages can be tested before assembly and faulty units easily filtered out. Final device testing also becomes much more straightforward.

Efficient and powerful in action

The result? LED cabinets that deliver high brightness, strong contrast, and reliable performance. The package design also offers protection against moisture, dust, and mechanical stress – a major benefit for real-world use.

What’s true for production also applies to maintenance and repair: unlike some other technologies, MIP packages don’t require an additional epoxy layer for protection. This means faulty LEDs can be replaced much more easily, without having to remove or destroy surrounding components. Heat dissipation is also highly effective, thanks to the optimized structure.

Micro LED in Package positions itself as a technically mature, efficient, and highly practical solution for modern LED displays. It’s not just an alternative to existing technologies – MIP is a standalone answer to the challenges of today’s LED world. With brilliant image quality, flexible manufacturing, and robust design, MIP has earned its place in the spotlight – even if it got there quietly.