Around a year ago, LANG introduced a groundbreaking product at their ISE booth: the LEDgend. With a pixel pitch of just 0.9 mm—breaking the much-debated one-millimeter barrier for the first time in the company’s history—it caused quite a stir. Boasting an 8K resolution, outstanding image quality, and remarkable efficiency across a massive 3.7 meters in height and 7.2 meters in width, it delivered an experience unlike anything LANG had showcased before. Unsurprisingly, the LEDgend wall was a showstopper at ISE 2024.

The LEDgend 0.9 marked a milestone for another reason as well: it was LANG’s first COB product. Since then, it hasn’t remained the only one—another addition to the lineup, the LEDgend 1.5, has now joined us. The more we explore the tech, the more we can see why it’s creating such a buzz.

Our 2025 preview has already made one thing clear: COB is here to stay. But why is this technology more relevant than ever? What benefits does it offer, and what exactly is COB?

COB – what does it mean?

To answer that last question right away: COB stands for “Chip On Board.” This technology involves placing the red, blue, and green LED chips directly onto the PCB (Printed Circuit Board) rather than embedding them in LED packaging, as is typical with technologies such as SMD or MIP.

This technical distinction brings the first major advantage: direct installation eliminates several production steps compared to other technologies, saving both production time and costs. Moreover, the absence of LED packages allows for significantly smaller pixel pitches—as demonstrated with the LEDgend 0.9. Additionally, COB offers better thermal management, enabling more efficient heat dissipation.

The advantages don’t stop there, though. Alongside its cost efficiency, COB technology delivers comparable or even superior performance. It offers higher brightness compared to similar LED products and better energy efficiency. Furthermore, COB products are especially robust: their coated surfaces not only make them durable but also give them a homogeneous appearance.

Smooth like a display

When looking at the LEDgend’s sub-one-millimeter pixel pitch, many noted its display-like feel—a result of its coated, ultra-smooth surface. This highlights the enormous potential COB products like the LEDgend have for seamless, continuous, and razor-sharp imagery, even when viewed up close.

Speaking of potential: the possibilities with COB are far from fully realized by now. While it has been mostly focused on indoor applications, there are a growing number of outdoor COB solutions coming to market. The technology also allows for the use of increasingly smaller chips, pushing pixel pitches to even tighter dimensions.

Where COB is going

Research is advancing in the realm of substrates as well: Chip On Glass (COG) technology, for example, could enable more precise chip placement and even greater energy efficiency. Active Matrix technology, already used in products like the transparent MUXWAVE, may also play a role in COB’s evolution, potentially eliminating scan lines.

The LEDgend family has two members now, the 0.9 and the 1.5 variant. And this is just the beginning. Both the LEDgend series and COB products in general have the potential to set new standards with their focus on efficiency, image quality, and sustainability.

Looking ahead, LANG is set to provide an exciting glimpse into the future at ISE 2025. At booth 3H500, visitors will not only see the current LEDgend series but also get a first look at new developments in COB technology.